With plans to commercialize High Resolution De-bondable Panel (HRDP), a special glass carrier for next-generation semiconductor packaging devices, Mitsui Mining & Smelting Co., Ltd. (Mitsui Kinzoku; Tokyo) has been working toward the establishment of a system for mass production in collaboration with Geomatec Co., Ltd. Now,Mitsui Kinzoku has announced that mass production of HRDP has started for a domestic multi-chip module manufacturer.
Mitsui Mining & Smelting initiates mass production of HRDP, a special glass carrier for nNext-generation semiconductor packaging devices (Source: Mitsui Kinzoku)
In its January 2018 news release, Mitsui Kinzoku announced the development of HRDP, a material for the creation of ultra-fine circuits using a glass carrier for the Fan Out panel level package, based on the RDL First method.
HRDP is a special glass carrier capable of achieving high production efficiency of Fan Out packages (substrate-less packaging technology with ultra-fine re-distribution layer extended outside the chip size), the next-generation semiconductor packaging technologies, including ultra-high density circuits designed with a line/space (L/S) ratio of 2/2 μm or less. Currently, over 20 customers are evaluating HRDP for commercialization.
As the first stage, mass production for a domestic multi-chip module manufacturer began in January 2021. This customer will use HRDP to manufacture devices for the 5G market, which is expected to expand in the future, including RF modules, and other devices for a variety of applications with plans to increase sales.
As the second stage, an overseas leading package manufacturer is planning to adopt HRDP within 2021.
In addition, there are plans to initiate the mass production at the other new customers for a variety of applications, such as high-performance computing and mobile phones for 2022 and onward.