Immersion cooling
Perstorp Holding AB (Malmö Perstorp, Sweden; www.perstorp.com) and Intel Corp.’s (Santa Clara, Calif.; www.intel.com) Open IP Advanced Liquid Cooling team have developed a high-performance synthetic thermal-management fluid specifically designed for immersion cooling in data centers.
The partners recently participated in Computex 2024 in Taipei, where Intel showcased its Gaudi 3 AI accelerator technology. The accelerator uses Intel’s SuperFluid Cooling Technology, which leverages the low viscosity and high flash point balance of Perstorp’s advanced synthetic thermal-management fluid.
In comparison to conventional, single-phase immersion cooling with its cooling capacity of about 500 W per chip, Intel’s SuperFluid technology, which uses air as a lubrication system, can increase cooling capacity to 800 W. The cooling capacity per chip can be further improved to 1,500 W when this is combined with the low-viscosity properties of Perstorp’s advanced synthetic thermal-management fluid, together with flow-field management, optimized system control and intelligent management of the Cooling Distribution Unit.